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Journal description
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Details for article 4 of 15 found articles
| Title: |
Highly reliable flip-chip-on-flex package using multilayered anisotropic conductive film |
| Author: |
Yim, Myung Jin Hwang, Jin-Sang Kim, Jin Gu Ahn, Jin Yong Kim, Hyung Joon Kwon, Woonseong Paik, Kyung-Wook |
| Appeared in: |
Journal of electronic materials |
| Paging: | Volume 33 (2004) nr. 1 pages 76-82 |
| Year: |
2004 |
| Contents: | |
| Publisher: |
Springer-Verlag, New York |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 4 of 15 found articles
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