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Journal description
All volumes of the corresponding journal
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Details for article 8 of 26 found articles
| Title: |
High creep resistance tin-based alloys for soldering applications |
| Author: |
Mccabe, Rodney J. Fine, Morris E. |
| Appeared in: |
Journal of electronic materials |
| Paging: | Volume 31 (2002) nr. 11 pages 1276-1282 |
| Year: |
2002 |
| Contents: | |
| Publisher: |
Springer-Verlag, New York |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 8 of 26 found articles
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