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Journal description
All volumes of the corresponding journal
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All articles of the corresponding issues
Details for article 6 of 26 found articles
| Title: |
Failure mechanism of lead-free solder joints in flip chip packages |
| Author: |
Zhang, Fan Li, Ming Balakrisnan, Bavani Chen, William T. |
| Appeared in: |
Journal of electronic materials |
| Paging: | Volume 31 (2002) nr. 11 pages 1256-1263 |
| Year: |
2002 |
| Contents: | |
| Publisher: |
Springer-Verlag, New York |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 6 of 26 found articles
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