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Journal description
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Details for article 36 of 48 found articles
| Title: |
Quantifying the subsurface damage and residual stress in ground silicon wafer using laser ultrasonic technology: A Bayesian approach |
| Author: |
Liu, Zaiwei Lin, Bin Liang, Xiaohu Du, Anyao |
| Appeared in: |
Mechanical systems and signal processing |
| Paging: | Volume 173 () nr. C pages p. |
| Year: |
2022 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 36 of 48 found articles
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