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                                       Details for article 9 of 17 found articles
 
 
  Experimental study of copper leveling additives and their wafer and pattern-scale effect on copper planarization
 
 
Title: Experimental study of copper leveling additives and their wafer and pattern-scale effect on copper planarization
Author: Kelly, James
Surisetty, Charan
Canaperi, Donald
Appeared in: Comptes rendus chimie
Paging: Volume 16 (2013) nr. 1 pages 6 p.
Year: 2013
Contents:
Publisher: Académie des sciences
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 9 of 17 found articles
 
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