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                                       Details for article 5 of 6 found articles
 
 
  Monolithic 3D integration as a pathway to energy-efficient computing and beyond: From materials and devices to architectures and chips
 
 
Title: Monolithic 3D integration as a pathway to energy-efficient computing and beyond: From materials and devices to architectures and chips
Author: Fan, Yijia
An, Ran
Tang, Jianshi
Li, Yijun
Liu, Ting
Gao, Bin
Qian, He
Wu, Huaqiang
Appeared in: Current Opinion in Solid State & Materials Science
Paging: Volume 33 () nr. C pages p.
Year: 2024
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 5 of 6 found articles
 
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