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Journal description
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Details for article 6 of 90 found articles
| Title: |
Biaxial bending strength of thin silicon dies in the ring-on-ring test by considering geometric nonlinearity and material anisotropy |
| Author: |
Tsai, M.Y. Kuo, T.C. Hsieh, P.J. Huang, P.S. |
| Appeared in: |
Materials science in semiconductor processing |
| Paging: | Volume 186 () nr. C pages p. |
| Year: |
2025 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 6 of 90 found articles
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