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                                       Details for article 19 of 35 found articles
 
 
  Impact of the temperature process on the morphology of 3D temporary bonded wafers: Quantification and reducing of the effect
 
 
Title: Impact of the temperature process on the morphology of 3D temporary bonded wafers: Quantification and reducing of the effect
Author: Montméat, P.
Le Cocq, M.
Enot, T.
Zussy, M.
Fournel, F.
Appeared in: Materials science in semiconductor processing
Paging: Volume 136 () nr. C pages p.
Year: 2021
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 19 of 35 found articles
 
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 Koninklijke Bibliotheek - National Library of the Netherlands