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Journal description
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Details for article 19 of 60 found articles
| Title: |
Investigation on the sawing temperature in ultrasonic vibration assisted diamond wire sawing monocrystalline silicon |
| Author: |
Wang, Yan Song, Li-Xing Liu, Jian-Guo Wang, Rui Zhao, Bo-Cheng |
| Appeared in: |
Materials science in semiconductor processing |
| Paging: | Volume 135 () nr. C pages p. |
| Year: |
2021 |
| Contents: | |
| Publisher: |
Published by Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 19 of 60 found articles
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