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  A study of the effect of post-metal etch wet cleaning processes and silicon oxynitride film on charge induced corrosion of tungsten vias
 
 
Title: A study of the effect of post-metal etch wet cleaning processes and silicon oxynitride film on charge induced corrosion of tungsten vias
Author: Lee, Szetsen
Ni, Chi-Jung
Appeared in: Materials science in semiconductor processing
Paging: Volume 13 (2010) nr. 5-6 pages 5 p.
Year: 2010
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

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