A modulus-engineered multi-layer polymer film with mechanical robustness for the application to highly deformable substrate platform in stretchable electronics
Titel:
A modulus-engineered multi-layer polymer film with mechanical robustness for the application to highly deformable substrate platform in stretchable electronics
Auteur:
Kim, Youson Kim, Junmo Kim, Chan Young Kim, Taehyun Lee, Chungryeol Jeong, Kihoon Jo, Woosung Yoo, Seunghyup Kim, Taek-Soo Choi, Kyung Cheol Im, Sung Gap