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Journal description
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Details for article 21 of 90 found articles
| Title: |
Covalent bond-assisted continuous interface structure for high thermal conductive polyimide composite films |
| Author: |
Wang, Fan Dong, Xiaodi Liu, Guangyi Wan, Baoquan Gao, Jinghui Liu, Baixin Zha, Jun-Wei |
| Appeared in: |
Composites. Part A, Applied science and manufacturing |
| Paging: | Volume 185 () nr. C pages p. |
| Year: |
2024 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 21 of 90 found articles
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