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High-performance epoxy/binary spherical alumina composite as underfill material for electronic packaging |
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Titel: |
High-performance epoxy/binary spherical alumina composite as underfill material for electronic packaging |
Auteur: |
Chen, Chao Xue, Yang Li, Xiongwei Wen, Yingfeng Liu, Jinwei Xue, Zhigang Shi, Dean Zhou, Xingping Xie, Xiaolin Mai, Yiu-Wing |
Verschenen in: |
Composites. Part A, Applied science and manufacturing |
Paginering: |
Jaargang 118 (2019) nr. C pagina's 67-74 |
Jaar: |
2019 |
Inhoud: |
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Uitgever: |
Elsevier Ltd |
Bronbestand: |
Elektronische Wetenschappelijke Tijdschriften |
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