Development of Ag@Si composite sinter joining with ultra-high resistance to thermal shock test for SiC power device: Experiment validation and numerical simulation
Titel:
Development of Ag@Si composite sinter joining with ultra-high resistance to thermal shock test for SiC power device: Experiment validation and numerical simulation
Auteur:
Liu, Yang Chen, Chuantong Wang, Ye Zhang, Zheng Liu, Ran Ueshima, Minoru Ota, Ichiro Nishikawa, Hiroshi Nishijima, Masahiko Nakayama, Koji S. Suganuma, Katsuaki