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Failure mechanisms of the bonded interface between mold epoxy and metal substrate exposed to high temperature |
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Titel: |
Failure mechanisms of the bonded interface between mold epoxy and metal substrate exposed to high temperature |
Auteur: |
Zhao, Shuaijie Chen, Chuantong Haga, Motoharu Ueshima, Minoru Hirahara, Hidetoshi Sang, Jing Cho, Sung hun Sekino, Tohru Suganuma, Katsuaki |
Verschenen in: |
Composites. Part B, Engineering |
Paginering: |
Jaargang 254 () nr. C pagina's p. |
Jaar: |
2023 |
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Uitgever: |
Published by Elsevier B.V. |
Bronbestand: |
Elektronische Wetenschappelijke Tijdschriften |
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