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Journal description
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Details for article 26 of 51 found articles
| Title: |
Mechanical, electrical, and thermal reliability of Sn-58wt.%Bi solder joints with Ag-decorated MWCNT for LED package component during aging treatment |
| Author: |
Park, Bum-Geun Myung, Woo-Ram Lee, Choong-Jae Jung, Seung-Boo |
| Appeared in: |
Composites. Part B, Engineering |
| Paging: | Volume 182 () nr. C pages p. |
| Year: |
2020 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 26 of 51 found articles
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