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Details for article 72 of 6123 found articles
| Title: |
Achieving low-temperature wafer level bonding with Cu-Sn-In ternary at 150 °C |
| Author: |
Golim, Obert Vuorinen, Vesa Ross, Glenn Wernicke, Tobias Pawlak, Marta Tiwary, Nikhilendu Paulasto-Kröckel, Mervi |
| Appeared in: |
Scripta materialia |
| Paging: | Volume 222 () nr. C pages p. |
| Year: |
2023 |
| Contents: | |
| Publisher: |
Published by Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 72 of 6123 found articles
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