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Details for article 3148 of 6123 found articles
| Title: |
In situ study on the increase of intermetallic compound thickness at anode of molten tin due to electromigration of copper |
| Author: |
Ma, Haitao Kunwar, Anil Sun, Junhao Guo, Bingfeng Ma, Haoran |
| Appeared in: |
Scripta materialia |
| Paging: | Volume 107 (2015) nr. C pages 88-91 |
| Year: |
2015 |
| Contents: | |
| Publisher: |
Acta Materialia Inc. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 3148 of 6123 found articles
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