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Journal description
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Details for article 2583 of 6152 found articles
| Title: |
Growth behavior of tin whisker on SnAg microbump under compressive stress |
| Author: |
Sun, Menglong Dong, Mengya Wang, Dongfan Ling, Huiqin Hu, An-min Li, Ming |
| Appeared in: |
Scripta materialia |
| Paging: | Volume 147 (2018) nr. C pages 114-118 |
| Year: |
2018 |
| Contents: | |
| Publisher: |
Acta Materialia Inc. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 2583 of 6152 found articles
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