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Journal description
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Details for article 218 of 6123 found articles
| Title: |
A metastable phase of tin in 3D integrated circuit solder microbumps |
| Author: |
Liu, Yingxia Tamura, Nobumichi Kim, Dong Wook Gu, Sam Tu, K.N. |
| Appeared in: |
Scripta materialia |
| Paging: | Volume 102 (2015) nr. C pages 4 p. |
| Year: |
2015 |
| Contents: | |
| Publisher: |
Acta Materialia Inc. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 218 of 6123 found articles
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