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Details for article 4751 of 6123 found articles
| Title: |
Room temperature bonding of GaN on diamond wafers by using Mo/Au nano-layer for high-power semiconductor devices |
| Author: |
Wang, Kang Ruan, Kun Hu, Wenbo Wu, Shengli Wang, Hongxing |
| Appeared in: |
Scripta materialia |
| Paging: | Volume 174 (2020) nr. C pages 87-90 |
| Year: |
2020 |
| Contents: | |
| Publisher: |
Acta Materialia Inc. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 4751 of 6123 found articles
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