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Details for article 3039 of 6123 found articles
| Title: |
Inhibiting the detrimental Cu protrusion in Cu through-silicon-via by highly (111)-oriented nanotwinned Cu |
| Author: |
Lin, Ting-Chun Liang, Chien-Lung Wang, Shan-Bo Lin, Yung-Sheng Kao, Chin-Li Tarng, David Lin, Kwang-Lung |
| Appeared in: |
Scripta materialia |
| Paging: | Volume 197 () nr. C pages p. |
| Year: |
2021 |
| Contents: | |
| Publisher: |
Acta Materialia Inc. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 3039 of 6123 found articles
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