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Journal description
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Details for article 43 of 778 found articles
| Title: |
Anisotropic grain growth and crack propagation in eutectic microstructure under cyclic temperature annealing in flip-chip SnPb composite solder joints |
| Author: |
Liang, Y.C. Lin, H.W. Chen, H.P. Chen, C. Tu, K.N. Lai, Y.S. |
| Appeared in: |
Scripta materialia |
| Paging: | Volume 69 (2013) nr. 1 pages 4 p. |
| Year: |
2013 |
| Contents: | |
| Publisher: |
Acta Materialia Inc. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 43 of 778 found articles
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