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Journal description
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Details for article 4 of 22 found articles
| Title: |
Damping characteristics of Sn–3Ag–0.5Cu and Sn–37Pb solders studied by dynamic mechanical analysis |
| Author: |
Chang, S.H. Wu, S.K. |
| Appeared in: |
Scripta materialia |
| Paging: | Volume 63 (2010) nr. 10 pages 4 p. |
| Year: |
2010 |
| Contents: | |
| Publisher: |
Acta Materialia Inc. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 4 of 22 found articles
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