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Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
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Details for article 16 of 20 found articles
| Title: |
Suppressing Ni–Sn–P growth in SnAgCu/Ni–P solder joints |
| Author: |
Lin, Yung-Chi Shih, Toung-Yi Tien, Shih-Kang Duh, Jenq-Gong |
| Appeared in: |
Scripta materialia |
| Paging: | Volume 56 (2007) nr. 1 pages 4 p. |
| Year: |
2007 |
| Contents: | |
| Publisher: |
Acta Materialia Inc. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 16 of 20 found articles
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