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Details for article 1 of 11 found articles
| Title: |
A study on correlation of thermal mismatch stress of SiCw/Al composite through curves of thermal expansion coefficient |
| Author: |
Hu, Ming Fei, Wei-Dong Yao, Cong-Kai |
| Appeared in: |
Scripta materialia |
| Paging: | Volume 46 (2002) nr. 8 pages 5 p. |
| Year: |
2002 |
| Contents: | |
| Publisher: |
Published by Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 1 of 11 found articles
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