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Verification of the ability of Cu to dissolve in BCC δ in a δ-γ Solid Solution above 1200 °C and boosting δ nano-hardness in Cu-containing PHSS |
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Titel: |
Verification of the ability of Cu to dissolve in BCC δ in a δ-γ Solid Solution above 1200 °C and boosting δ nano-hardness in Cu-containing PHSS |
Auteur: |
Gan, Neng-Hao Sun, Yi-Hsuan Tsao, Tzu-Ching Li, Chia-Lin Liu, Jia-Heng Yen, Hung-Wei Hsueh, Chun-Hway Yang, Jer-Ren Wang, Shing-Hoa Yeh, Jien-Wei Chang, Horng-Yi Hou, Wen-Hsing |
Verschenen in: |
Scripta materialia |
Paginering: |
Jaargang 211 () nr. C pagina's p. |
Jaar: |
2022 |
Inhoud: |
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Uitgever: |
Acta Materialia Inc. |
Bronbestand: |
Elektronische Wetenschappelijke Tijdschriften |
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