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Analytical approach for describing the collapse of surface asperities under compressive stress during rapid solid state bonding |
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Titel: |
Analytical approach for describing the collapse of surface asperities under compressive stress during rapid solid state bonding |
Auteur: |
Chen, Gaoqiang Feng, Zhili Chen, Jian Liu, Lei Li, Han Liu, Qu Zhang, Shuai Cao, Xiong Zhang, Gong Shi, Qingyu |
Verschenen in: |
Scripta materialia |
Paginering: |
Jaargang 128 (2017) nr. C pagina's 4 p. |
Jaar: |
2017 |
Inhoud: |
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Uitgever: |
Elsevier Ltd |
Bronbestand: |
Elektronische Wetenschappelijke Tijdschriften |
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