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                                       Details for article 26 of 41 found articles
 
 
  Interplay between grain boundary segregation and electrical resistivity in dilute nanocrystalline Cu alloys
 
 
Title: Interplay between grain boundary segregation and electrical resistivity in dilute nanocrystalline Cu alloys
Author: Kim, Gyuseok
Chai, Xuzhao
Yu, Le
Cheng, Xuemei
Gianola, Daniel S.
Appeared in: Scripta materialia
Paging: Volume 123 (2016) nr. C pages 113-117
Year: 2016
Contents:
Publisher: Elsevier B.V.
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 26 of 41 found articles
 
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 Koninklijke Bibliotheek - National Library of the Netherlands