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Journal description
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Details for article 16 of 41 found articles
| Title: |
Fracture toughness of intermetallic Cu6Sn5 in lead-free solder microelectronics |
| Author: |
Philippi, Bastian Matoy, Kurt Zechner, Johannes Kirchlechner, Christoph Dehm, Gerhard |
| Appeared in: |
Scripta materialia |
| Paging: | Volume 123 (2016) nr. C pages 38-41 |
| Year: |
2016 |
| Contents: | |
| Publisher: |
Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 16 of 41 found articles
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