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Journal description
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Details for article 19 of 35 found articles
| Title: |
Interface reaction between an electroless Ni–Co–P metallization and Sn–3.5Ag lead-free solder with improved joint reliability |
| Author: |
Yang, Ying Balaraju, J.N. Huang, Yizhong Liu, Hai Chen, Zhong |
| Appeared in: |
Acta Materialia |
| Paging: | Volume 71 (2014) nr. C pages 11 p. |
| Year: |
2014 |
| Contents: | |
| Publisher: |
Acta Materialia Inc. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 19 of 35 found articles
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