|
| << previous | next >> |
Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 21 of 38 found articles
| Title: |
Laue scanner: A new method for determination of grain orientations and grain boundary types of multicrystalline silicon on a full wafer scale |
| Author: |
Lehmann, Toni Trempa, Matthias Meissner, Elke Zschorsch, Markus Reimann, Christian Friedrich, Jochen |
| Appeared in: |
Acta Materialia |
| Paging: | Volume 69 (2014) nr. C pages 8 p. |
| Year: |
2014 |
| Contents: | |
| Publisher: |
Acta Materialia Inc. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 21 of 38 found articles
| << previous | next >> |