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                                       Details for article 7 of 37 found articles
 
 
  Damage evolution during cyclic tension–tension loading of micron-sized Cu lines
 
 
Title: Damage evolution during cyclic tension–tension loading of micron-sized Cu lines
Author: Wimmer, A.
Leitner, A.
Detzel, T.
Robl, W.
Heinz, W.
Pippan, R.
Dehm, G.
Appeared in: Acta Materialia
Paging: Volume 67 (2014) nr. C pages 11 p.
Year: 2014
Contents:
Publisher: Acta Materialia Inc.
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 7 of 37 found articles
 
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 Koninklijke Bibliotheek - National Library of the Netherlands