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Journal description
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Details for article 21 of 34 found articles
| Title: |
Investigation of diffusion and electromigration parameters for Cu–Sn intermetallic compounds in Pb-free solders using simulated annealing |
| Author: |
Chao, Brook Chae, Seung-Hyun Zhang, Xuefeng Lu, Kuan-Hsun Im, Jay Ho, P.S. |
| Appeared in: |
Acta Materialia |
| Paging: | Volume 55 (2007) nr. 8 pages 10 p. |
| Year: |
2007 |
| Contents: | |
| Publisher: |
Acta Materialia Inc. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 21 of 34 found articles
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