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Journal description
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Details for article 1 of 19 found articles
| Title: |
A new investigation of copper's role in enhancing Al–Cu interconnect electromigration resistance from an atomistic view |
| Author: |
Liu, X.-Y Liu, C.-L Borucki, L.J |
| Appeared in: |
Acta Materialia |
| Paging: | Volume 47 (1999) nr. 11 pages 5 p. |
| Year: |
1999 |
| Contents: | |
| Publisher: |
Acta Metallurgica Inc. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 1 of 19 found articles
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