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Journal description
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Details for article 29 of 66 found articles
| Title: |
Enhanced reliability of Cu-Sn bonding through the microstructure evolution of nanotwinned copper |
| Author: |
Jin, Xinyu Li, Huahan Sun, Yingying Chen, Zhiqin Chen, Peixin Su, Hongwei Li, Ming Wu, Yunwen |
| Appeared in: |
Acta Materialia |
| Paging: | Volume 283 () nr. C pages p. |
| Year: |
2025 |
| Contents: | |
| Publisher: |
Acta Materialia Inc. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 29 of 66 found articles
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