Intragranular thermal fatigue of Cu thin films: Near-grain boundary hardening, strain localization and voiding
Titel:
Intragranular thermal fatigue of Cu thin films: Near-grain boundary hardening, strain localization and voiding
Auteur:
Hlushko, K. Ziegelwanger, T. Reisinger, M. Todt, J. Meindlhumer, M. Beuer, S. Rommel, M. Greving, I. Flenner, S. Kopeček, J. Keckes, J. Detlefs, C. Yildirim, C.