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                                       Details for article 22 of 45 found articles
 
 
  Measurement of anisotropic coefficients of thermal expansion of SAC305 solder using surface strains of single grain with arbitrary orientation
 
 
Title: Measurement of anisotropic coefficients of thermal expansion of SAC305 solder using surface strains of single grain with arbitrary orientation
Author: Wu, Bulong
Yang, Yu-Hsiang
Han, Bongtae
Schumacher, Joshua
Appeared in: Acta Materialia
Paging: Volume 156 () nr. C pages 196-204
Year: 2018
Contents:
Publisher: Acta Materialia Inc.
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 22 of 45 found articles
 
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 Koninklijke Bibliotheek - National Library of the Netherlands