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Journal description
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Details for article 29 of 41 found articles
| Title: |
Role of diffusion anisotropy in β-Sn in microstructural evolution of Sn-3.0Ag-0.5Cu flip chip bumps undergoing electromigration |
| Author: |
Huang, M.L. Zhao, J.F. Zhang, Z.J. Zhao, N. |
| Appeared in: |
Acta Materialia |
| Paging: | Volume 100 () nr. C pages 98-106 |
| Year: |
2015 |
| Contents: | |
| Publisher: |
Acta Materialia Inc. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 29 of 41 found articles
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