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                                       Details for article 2 of 41 found articles
 
 
  Cavitation at filler metal/substrate interface during ultrasonic-assisted soldering. Part I: Cavitation characteristics
 
 
Title: Cavitation at filler metal/substrate interface during ultrasonic-assisted soldering. Part I: Cavitation characteristics
Author: Li, Zhengwei
Xu, Zhiwu
Ma, Lin
Wang, Sheng
Liu, Xuesong
Yan, Jiuchun
Appeared in: Ultrasonics sonochemistry
Paging: Volume 49 (2018) nr. C pages 249-259
Year: 2018
Contents:
Publisher: Elsevier B.V.
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 2 of 41 found articles
 
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 Koninklijke Bibliotheek - National Library of the Netherlands