|
| << previous | next >> |
Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 12 of 16 found articles
| Title: |
Relationship between morphologies and orientations of Cu6Sn5 grains in Sn3.0Ag0.5Cu solder joints on different Cu pads |
| Author: |
Tian, Yanhong Zhang, Rui Hang, Chunjin Niu, Lina Wang, Chunqing |
| Appeared in: |
Materials characterization |
| Paging: | Volume 88 (2014) nr. C pages 11 p. |
| Year: |
2014 |
| Contents: | |
| Publisher: |
Elsevier Inc. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 12 of 16 found articles
| << previous | next >> |