|
| << previous | next >> |
Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 6 of 10 found articles
| Title: |
Impact of annealing, surface/strain energy and linewidth to line spacing ratio on texture evolution in damascene Cu interconnects |
| Author: |
Mirpuri, Kabirkumar Szpunar, Jerzy |
| Appeared in: |
Materials characterization |
| Paging: | Volume 54 (2005) nr. 2 pages 16 p. |
| Year: |
2005 |
| Contents: | |
| Publisher: |
Elsevier Inc. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 6 of 10 found articles
| << previous | next >> |