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Journal description
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Details for article 11 of 11 found articles
| Title: |
Three-dimensional microstructure characterization of Ag3Sn intermetallics in Sn-rich solder by serial sectioning |
| Author: |
Sidhu, R.S Chawla, N |
| Appeared in: |
Materials characterization |
| Paging: | Volume 52 (2004) nr. 3 pages 6 p. |
| Year: |
2004 |
| Contents: | |
| Publisher: |
Elsevier Inc. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 11 of 11 found articles
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