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Journal description
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Details for article 7 of 11 found articles
| Title: |
Phase Analysis in the Solder Joint of Sn-Cu Solder/IMCs/Cu Substrate |
| Author: |
Lee, Y.G. Duh, J.G. |
| Appeared in: |
Materials characterization |
| Paging: | Volume 42 (1999) nr. 2-3 pages 18 p. |
| Year: |
1999 |
| Contents: | |
| Publisher: |
Elsevier Science Inc. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 7 of 11 found articles
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