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  Accumulative roll 5 cycles forged Cu/Ag multilayered preforms for high-temperature die-attach interconnections
 
 
Title: Accumulative roll 5 cycles forged Cu/Ag multilayered preforms for high-temperature die-attach interconnections
Author: Liu, Canyu
Chen, Chuantong
Liu, Changqing
Suganuma, Katsuaki
Appeared in: Materials characterization
Paging: Volume 221 () nr. C pages p.
Year: 2025
Contents:
Publisher: Elsevier Inc.
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

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