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                                       Details for article 69 of 130 found articles
 
 
  Low-temperature Cu-Cu direct bonding with ultra-large grains using highly (110)-oriented nanotwinned copper
 
 
Title: Low-temperature Cu-Cu direct bonding with ultra-large grains using highly (110)-oriented nanotwinned copper
Author: Li, Huahan
Liang, Zhaolan
Ning, Zeyu
Liu, Ziyu
Li, Ming
Wu, Yunwen
Appeared in: Materials characterization
Paging: Volume 217 () nr. C pages p.
Year: 2024
Contents:
Publisher: Elsevier Inc.
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 69 of 130 found articles
 
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 Koninklijke Bibliotheek - National Library of the Netherlands