Digital Library
Close Browse articles from a journal
 
<< previous   
     Journal description
       All volumes of the corresponding journal
         All issues of the corresponding volume
           All articles of the corresponding issues
                                       Details for article 73 of 73 found articles
 
 
  Vacuum diffusion bonding of TC4 titanium alloy to T2 copper with VCrNi1.8 eutectic medium entropy alloy interlayer
 
 
Title: Vacuum diffusion bonding of TC4 titanium alloy to T2 copper with VCrNi1.8 eutectic medium entropy alloy interlayer
Author: Wu, Baosheng
Li, Peng
Ma, Yueting
Li, Chao
Huang, Libing
Zhang, Liangliang
Li, Jiachen
Dong, Honggang
Appeared in: Materials characterization
Paging: Volume 214 () nr. C pages p.
Year: 2024
Contents:
Publisher: Published by Elsevier B.V.
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 73 of 73 found articles
 
<< previous   
 
 Koninklijke Bibliotheek - National Library of the Netherlands