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Details for article 32 of 73 found articles
| Title: |
Enhancement of Cu-to-Cu bonding property by residual stress in Cu substrate |
| Author: |
Wang, Hung Chen, Ping-Hsuan Kung, Cheng-Hao Chang, Po-Kai Chiu, Shang-Jui Lin, Yan-Gu Wang, Chan-Meng Wu, Albert T. |
| Appeared in: |
Materials characterization |
| Paging: | Volume 214 () nr. C pages p. |
| Year: |
2024 |
| Contents: | |
| Publisher: |
Published by Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 32 of 73 found articles
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