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                                       Details for article 30 of 67 found articles
 
 
  Influence behavior and mechanism of crystal orientation of Cu6Sn5 coating on interfacial intermetallic compounds growth in Sn-0.7Cu/Cu solder joint
 
 
Title: Influence behavior and mechanism of crystal orientation of Cu6Sn5 coating on interfacial intermetallic compounds growth in Sn-0.7Cu/Cu solder joint
Author: Zhang, Zhihang
Qu, Jiawei
Ma, Tao
Zhao, Yue
Zhou, Zhongshan
Huang, Jihua
Chen, Shuhai
Ye, Zheng
Yang, Jian
Appeared in: Materials characterization
Paging: Volume 210 () nr. C pages p.
Year: 2024
Contents:
Publisher: Elsevier Inc.
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 30 of 67 found articles
 
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