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Details for article 22 of 84 found articles
| Title: |
Effects of In and aging treatment on the microstructure, mechanical properties and electrochemical corrosion behavior of Sn2Cu solder alloy |
| Author: |
Tan, Sifan Zou, Minming Chen, Bin Zhang, Zezong Chen, Wenjing Hu, Xiaowu Jiang, Xiongxin Li, Qinglin |
| Appeared in: |
Materials characterization |
| Paging: | Volume 209 () nr. C pages p. |
| Year: |
2024 |
| Contents: | |
| Publisher: |
Published by Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 22 of 84 found articles
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